The thirteenth China semiconductor packaging and testing annual meeting (Xi'an 6.10-12) held
Release time：2017-03-21 Release people:Admin
The 13th China Semiconductor Packaging and Testing Conference, hosted by China Semiconductor Industry Association, Semiconductor Association Packaging Branch, Xi'an Economic and Technological Development Zone and Huatian Technology, will be held in Accor Shanghai People's Building from June 10 to June 12, 2015 . The conference is divided into China Semiconductor Summit Forum, seminars, industry research reports and other content. Packaging and testing industry will be on the development of the state; industry trends and market outlook; advanced packaging and testing technology, materials, equipment, technology, LED packaging; packaging design process technology.
For specific content and report release, please contact:
China Semiconductor Packaging Test Technology and Market Annual Conference Organizing Committee
